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Finchips 1G / 2G / 4G SPI NAND Flash Memory

DQ351GIAG 1Gb SPI NAN industrial grade SPI NAND flash findchips Winbond SPI NAND flash alternative GigaDevice GD5F series cross reference
Finchips  1G / 2G / 4G SPI NAND Flash Memory

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Product Detail

Findchips DQ35X Series: 1G / 2G / 4G SPI NAND Flash Memory

Premium Macronix Die Inside — Fully Compatible Replacement for Winbond & GigaDevice

The DQ351GIAG (1Gb), DQ352GIAG (2Gb), and DQ354GIAG (4Gb) series offer high-reliability embedded storage designed strictly for industrial-grade reliability. 

Built using original Macronix (MXIC) wafers/dies, this series guarantees tier-1 silicon

 quality, rigorous data retention, and long-term supply stability at a highly competitive cost.

Engineered as a seamless, drop-in cross-reference for industry-standard Winbond and

 GigaDevice SPI NAND flash, these components require no architecture redesign for

 applications such as industrial automation, smart meters, IoT gateways, and automotive electronics.

  • Key Parameters: Page Size: 2K+64 bytes | Reliable Block & Page Structure | Industrial Temperature Ready.
  • Drop-In Cross Matches: Direct replacement for Winbond W25N series & GigaDevice GD5F series.

100% New Original or tested reliability options available. 

Contact us directly on WhatsApp for data sheets, pin-out verifications, and instant quotes.

DQ351GIAG
Each device hasEach block hasEach page hasUnit
1Gb
128M+4M128K+4K2K+64bytes
1024x6464 
-
pages
1024 
-

-
blocks




DQ352GIAG

Each device has
Each block hasEach page hasUnit
2Gb
256M+4M128K+4K2K+64bytes

2048x64

64

-
pages
2048 
-

-
blocks




DQ354GIAG

Each device has
Each block hasEach page hasUnit
4Gb
512M+8M256K+8K2K+64
bytes
2048x64
128

-
pages
2048 
-
-blocks


No comment

Product Detail

Findchips DQ35X Series: 1G / 2G / 4G SPI NAND Flash Memory

Premium Macronix Die Inside — Fully Compatible Replacement for Winbond & GigaDevice

The DQ351GIAG (1Gb), DQ352GIAG (2Gb), and DQ354GIAG (4Gb) series offer high-reliability embedded storage designed strictly for industrial-grade reliability. 

Built using original Macronix (MXIC) wafers/dies, this series guarantees tier-1 silicon

 quality, rigorous data retention, and long-term supply stability at a highly competitive cost.

Engineered as a seamless, drop-in cross-reference for industry-standard Winbond and

 GigaDevice SPI NAND flash, these components require no architecture redesign for

 applications such as industrial automation, smart meters, IoT gateways, and automotive electronics.

  • Key Parameters: Page Size: 2K+64 bytes | Reliable Block & Page Structure | Industrial Temperature Ready.
  • Drop-In Cross Matches: Direct replacement for Winbond W25N series & GigaDevice GD5F series.

100% New Original or tested reliability options available. 

Contact us directly on WhatsApp for data sheets, pin-out verifications, and instant quotes.

DQ351GIAG
Each device hasEach block hasEach page hasUnit
1Gb
128M+4M128K+4K2K+64bytes
1024x6464 
-
pages
1024 
-

-
blocks




DQ352GIAG

Each device has
Each block hasEach page hasUnit
2Gb
256M+4M128K+4K2K+64bytes

2048x64

64

-
pages
2048 
-

-
blocks




DQ354GIAG

Each device has
Each block hasEach page hasUnit
4Gb
512M+8M256K+8K2K+64
bytes
2048x64
128

-
pages
2048 
-
-blocks


Finchips 1G / 2G / 4G SPI NAND Flash Memory
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